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The serial number or activation key for the following product(s) couldn’t be located:. The serial number or activation key for the following product(s) couldn’t be. Expanded Memory Manager (EMM) is an application that will speed up your Delphi projects and speed up.This invention relates to semiconductor devices and in particular to positive capacitors and to the lead connections therefor.
Flexible film, microcircuit chip dice are being manufactured with increased pin counts. In addition to the inner lead bonding pads on the active surface of the dice, separate outer lead bonding (OLB) pads are being provided to permit the dice to be surface mounted on a substrate.
Substantially the entire OLB area is intended for surface mounting purposes. However, the prior art packaging schemes for mounting the dice on the substrates are complex. For example, the leads of the dice are connected to their respective OLB pads by applying a plurality of preformed tape wraps of the leads, each lead being disposed on one layer of tape and connected to the OLB pads, and a plurality of tape layers in turn being disposed on the OLB pads and connected to the leads. The dice and substrate are then laminated under pressure and the leads are severed to separate the dice from the substrate. The dice are then severable from one another by bending the OLB leads to a point. Such a method requires a substantial amount of space for the tape layers and the tape wrap steps and is relatively expensive to implement.
The assembly may be implemented using the tape-automated bonding (TAB) method. However, the dice are essentially connected to their OLB pads without any positive connection. The TAB assembly is not sufficiently robust to permit dice to be bumped by a contactor or probe to carry out testing or other operations.
It is therefore the principal object of this invention to provide a packaged semiconductor device with a positive OLB lead connection.
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